Polyimide (PI) is an organic polymer material of imide. In preparation, diamines and dianhydrides are reacted to formpolyamic acid(PAA) by means of polymerization which is then transformed into polyimide polymers through imidization and dehydration at high temperature.

Heat Resistance PI has good weatherability, ranging from -270°C to 400°C.

Dimensional Stability With good dimensional stability, PI can maintain original dimensions after high-temperature processing.

Electrical Characteristics PI has excellent insulation property to protect the bottom layer of electronic components.

Chemical Resistance PI is insoluble in organic solvents and can thus resist corrosion.

Mechanical Property PI has extremely high modulus of elasticity and tensile strength.