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Black PI Fiml for Smart Phone
BK is non-transparent polyimide films. It presents low light transmission、reflectivity and excellent color uniformity. It is wildy used as coverlayer of flexible printed circuit boards (FPCB). |
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- Low light transmission
- Low reflectivity
- Good mechanical properties
- Good peel strength
- Superior MD/TD CTE balance
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- Coverlayer for Flexible Printed Circuit boards (FPCB)
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unit |
BK-012 |
BK-025 |
Test Method |
| Thickness |
um |
12.5 |
25 |
TMT method |
| Tensile Strength |
kgf/mm2 |
20 |
22 |
ASTM D 882 |
| Elongation |
% |
45 |
65 |
ASTM D 882 |
| Young's Modulus |
kgf/mm2 |
340 |
330 |
ASTM D 882 |
| CTE (100~200oC) |
ppm/oC |
31 |
26 |
TMA |
| Dimensional Stability |
% |
0.03 |
0.03 |
ASTM D 5214 |
| Peel strength |
kgf/cm |
1.0 |
1.0 |
IPC TM-650 |
| Dielectric Constant |
1MHz |
4.6 |
4.4 |
ASTM D 150 |
| Dissipation Factor |
1MHz |
0.033 |
0.022 |
ASTM D 150 |
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More information?
You are welcome at any time with our business personnel.
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Taimide Technology, Ltd. Tel:886-3-589-6088 Fax: 886-3-589-6099
No.127, Sec. 3, Wunde Rd., Sinpu Township, Hsinchu County 305, Taiwan (R.O.C.) Service eMail : marketing@taimide.com.tw Design : TENG
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