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Superior Dimensional Stability Polyimide Fiml
TL is a new generation polyimide film used for flexible printed circuit boards. It is suitable for fine pitch pattem due to its superior dimensional stability and lower coefficient of thermal expansion. |
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| properties |
unit |
TH-012 |
TL-012 |
Method |
| Thickness |
um |
12.5 |
12.5 |
TMT method |
| Young's Modulus |
kgf/mm2 |
340 |
420 |
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| Elongation |
% |
70 |
65 |
ASTM D 882 |
| Tensile Strength |
kgf/mm2 |
26 |
28 |
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| CTE (100~200oC) |
MD |
ppm/oC |
30 |
19 |
TMA |
| TD |
28 |
18 |
TMA |
| Heat Shrinkage |
% |
0.04 |
0.02 |
ASTM D 5214 |
| Water Absorption |
% |
1.4
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1.3 |
ASTM D 570
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More information?
You are welcome at any time with our business personnel.
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Taimide Technology, Ltd. Tel:886-3-589-6088 Fax: 886-3-589-6099
No.127, Sec. 3, Wunde Rd., Sinpu Township, Hsinchu County 305, Taiwan (R.O.C.) Service eMail : marketing@taimide.com.tw Design : TENG 
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