Polyimide, abbreviated as PI, is a polymer material with imide group. The reaction mechanism involves the addition of diamines and dianhydrides to form polyamic acid, abbreviated as PAA, and then react into polyimide after high temperature, imidization and dehydration.

Because of the excellent thermal stability, mechanical and chemical properties, PI is always the best choice of high performance polymer materials, especially for the application of electronic and IC industries that have strict materials specification. PI is in the position of key materials, such as high temperature tape, FPC, IC passivation coating, LCD alignment layer, and insulated materials, etc.