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Home > Technology innovation> Technology Roadmap |
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Application |
TH |
TL |
TX |
TA** |
BK |
LW |
| LED Light Bar |
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Small
size |
Medium
size |
Large
size |
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| Display (LCM) |
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Small
size |
Medium
size |
Large
size |
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○ |
| Notebook |
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| Mobile Phone |
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Package &
Semi-additive |
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Photovoltaic
Module |
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** TA = Pomiran ® |
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PI grade
Requirement |
TH |
TL |
TX |
Dimensional stability |
Normal |
Higher |
Ultra |
Pitch |
Large |
Medium |
Small |
FPC size |
Small |
Medium |
Large |
Flatness |
Low |
Medium |
High |
Softness |
Softest |
Softer |
Soft |
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Model |
Thickness
(mil) |
Application |
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TH |
H, 1, 2, 3 |
Normal FPCB / Stiffener |
TL |
H, 1 |
Fine pattern & large size FPCB (LCM module, Multi-layered… ) |
TX |
0.3, H, 1, 1.5, 2 |
IC package substrate (Driver IC, R-F PCB……..) |
BK |
H, 1 |
Coverlay of FPCB (Smart phone, optical element, LED light bar… ) |
LW |
1 |
Coverlay of FPCB(LED back light module) |
| TA ** |
H, 1, 1.5 |
Semi-additive PCB & FPCB (HDI, IC substrate, PV……..) |
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